ICES 268

COM Express™ Type 2, Basic Module with QM77 Intel® 3rd Generation Intel® Core™ rPGA988 Embedded Processors Family

Intel® 3rd generation Intel® Embedded Core™ rPGA988 embedded processors family

Intel® QM77 PCH (HM76) chipset support PICMG COM.0 Rev. 2.0 Type 2, pin-outs

Support two DDR3 SO-DIMMs 1333/1600 non-ECC up to 16GB

Support PCIex16 (Gen3.0), 5x PCIex1, 8x USB2.0, 2x SATA3.0/ 2x SATA2.0 and 1x GbE

Support VGA, dual channels 18/24-bit LVDS and optional 1x DDI/ SDVO by PEG

Dimension: 95mm (mm) x 125mm (L)

The ICES 268 is a Type 2 COM Express Basic Module featuring Intel® QM77 PCH (option HM76) chipset supports Intel® 3rd generation Intel® Core™ i7/i5/i3 rPGA988 processors up to i7-3610QE (4x 2.3Ghz/ max. TDP 45W) with two DDR3 SO-DIMMs 1333/1600MHz non-ECC up to 16GB.


The 3rd Generation Core i7/ i5/ i3 processors integrated with Intel® HD graphics with DX11 support one PCIex16 (Gen 3.0) to carrier board. The optional 1 x DDI interfaces port B, allows ICES 268 implement SDVO to HDMI, DVI, DP port by add-in EBK-A2HDMI. The high performance ICES 268 COM Express Basic Module supports 4x SATA3.0/ 2.0, 8x USB 2.0, 5x PCIex1 lanes and 1x Gigabit Ethernet through the carrier board; NEXCOM is offering standard Type 2 carrier board, ICEB 8050C as well as hardware-ready evaluation starter-kit, ICEK 8050C-T2 build-in 10.4” LCD panel, Flex-ATX power supply to help device makers and equipment builders may evaluate full set of I/O function and add-in cards at early development stage.


Support Intel® 3rd generation Core™ i7/i5/i3 embedded rPGA988


– Intel® Core™ i7-3610QE (4x 2.3GHz/ 6MB cache/ Max. TDP 45W)

– Intel® Core™ i7-3610ME (2x 2.7GHz/ 3MB cache/ Max. TDP 35W)

– Intel® Celeron® B810 (2x 1.6GHz/ 2MB cache/ Max. TDP 35W)

MemoryTwo DDR3 SO-DIMMs, 1333/1600 MHz SDRAM non-ECC up to 16GB
Platform Control HubIntel® QM77 PCH (option HM76) chipset


Plug and play support

Advanced Power Management and ACPI support


Intel® HD graphics with DX11 support and supports Triple independent displays

One PCI Express x16 Lane (Gen 3.0) down to the carried board

Supports VGA, single/dual channels LVDS 18/24-bit interfaces

Optional 1x DDI port B support HDMI, DVI, DisplayPort and SDVO by PEG with EBK-A2HDMI

AudioHD audio interface
On-board LAN

Intel® 82579LM Gigabit Ethernet, support iAMT 8.0 (supported by QM77 only)

Support boot from LAN, wake on LAN function

Signals down to I/O board

COM Express Connector


VGA/ LVDS/ 8x USB 2.0, HD Audio/ 2x SATA3.0, 2x SATA 2.0/ GbE/ GPIO/ LPC bus/ 5 x PCIex1/ SMBus (I2C)/ SPI BIOS / SPK out


PCIex16 (Gen. 3.0) / PCI (v2.3)/ IDE

Power Requirements+12V, +5VSB, +3.3V RTC power
Dimensions95mm (W) x 125mm (L)

Operating temperature: -15°C to 60°C

Storage temperature: -20°C to 80°C

Relative humidity: 10% to 90% (operating, non-condensing); 5% to 95% (non-operating, non-condensing)


Meet CE

FCC Class A

ICES 268 (P/N: 10K00026800X0)

COM Express type 2, basic Module QM77 support Intel® 3rd Generation Core™ rPGA988 embedded processors, non-ECC DDR3/ 2x SO-DIMMs

ICES 268 F- kit (P/N: 10K00026801X0)

COM Express Active fan kits with heat-spreader, heat-sink and cooling fan for ICES268

ICEB 8050C (P/N: 10KB0805001X0)

COM Express Type 2 R2.0 evaluation board with PCIe/ PCI/ SATA/ CF/ mPCIe/ IDE/ COM/ USB/ VGA/GbE and bootable from cFAST or mini-SATA.

ICEK 8050C-T2 (P/N: MISC by Project Registered)

COM Express Type 2 Starter Kit ready for NEXOM COM Express compact/ basic modules assembly SO-DIMM system memory with passive/ active fan-sink onto Type 2 carrier ICEB8050C with bootable mini-SATA/ CFast-SSD pre-load Win 7 trial version OS with 10.4" LCD/ LVDS display and build-in Flex-ATX PSU AC 110/220V Input

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