aROK 8110

Intel® 8th/9th Gen Core™/Xeon® CPU + Inference Accelerator AI Powered for Autonomous and Machine Vision

Rolling stock AI recognition and machine vision applications

Up to 8-core Intel® 8th/9th Gen Core™/Xeon® CPU processing power

4 x PCIe 3.0 slots for discrete graphics/inference/frame grabber cards

Ultra-fast NVMe M.2/U.2 media for high-speed multi-cameras image capture

RAID 0/1/5/10 configurable for data secure and integrity

24/36 VDC input with ignition management

Special fixture design avoids vibration issues with GPU and PCIe cards

Functionality of WWAN/5G NR, WLAN and GNSS with up to 4 SIM slots

Compliant with EN 50155 OT4 and MIL-STD-810G for anti-vibration/shock w/ graphics card and PCIe card installed

Smart fan design with temperature-based RPMs

AI has become an essential component of automated vehicle technology. With built-in high-performance Intel® Coffee-Lake S/Refresh, or Xeon® processing power and the powerful NVIDIA® GeForce® RTX 2080 Ti graphics engine with 4,352 CUDA® cores, aROK 8110 can satisfy a wide variety of applications for the rolling stock applications, such as track obstacle inspection, traffic light, traffic sign recognition, pantograph inspection and highly-demanding on graphic performance.

Extreme speed of data-storage has become more and more important as a rapid growth of high-speed multi-cameras with a high frame rates has taken place. For that, aROK 8110 is designed with up to 3 USB 3.1 and up to 12 GbE w/ PoE GigE M12 X-coded ports for high-end industrial cameras access to achieve a wire-speed performance. Also, the latest ultra-fast U.2/M.2 NVMe media and up to four 2.5” high-density SSD/HDD are carried out for customers to meet the requests of huge data streaming, secure and the integrity for multi-cameras installed.

aROK 8110 also provides an excellent expanding capability for users to install up to four add-on PCIe cards like the frame grabber in GigE Vision interface, or a discrete graphics engine to enhance the graphics power. To position where you are and to keep connection with the remote central management while the system is on edge computing, aROK 8110 is the best choice for you to provide a telematics functionality, like up to two LTE/WLAN modems, GNSS w/ DR function and eMTC collaborated with other communication ports, RS232/422/485 and CAN 2.0B module, etc.

aROK 8110 is a more elastic design for users to choose which CPU they want to operate. Also, it can support up to station-grade Xeon® w/ up to 80W TDP to work with the most 250W RTX 2080 Ti discrete graphics card.

CPUIntel® Coffee-Lake S/Refresh Core™/Xeon® i7/i5/i3/Pentium®/Celeron® processor (LGA1151)
PCHIntel® chipset C246

Two 260-pin DDR4 SO-DMIM sockets

Up to 32GB+32GB in size, 2400/2666 MHz

ECC memory to support: i3-8100/8100T, i3-9100T/9100TE, E-2124G, E-2278GE/2278GEL, G5400/5400T, G4900/4900


4 x 2.5” SATA 3.0 SSD/HDD (15mm height), or 3 x 2.5” SATA 3.0 SSD/HDD + 2 x M.2 2242/2260/2280 Key M NVMe SSD (PCIe 3.0 x2), or 3 x 2.5” SATA 3.0 SSD/HDD + 1 x U.2 NVMe SSD (PCIe 3.0 x2/SATA 3.0)

1 x CFast (externally accessible)


1 x Full size mPCIe socket (USB 2.0, PCIe 3.0)

1 x Full size mPCIe socket (USB 2.0) for LTE module, BOM optional M.2 3042 Key B socket (USB 2.0) for LTE module with 1 x external, 1 x internal SIM

1 x M.2 3042/3050/3052 Key B socket (USB 2.0, USB 3.1 Gen2) for LTE/5G NR module with 1 x external, 1 x internal SIM

1 x PCIe 3.0 x16 slot for discrete graphics card, up to 321mm in length

3 x PCIe 3.0 x4 slot, up to 240mm in length

GigE/Frame Grabber (optional)4 Port independent GbE w/ 802.3af/at, max. 60W, M12 X-coded
Discrete Graphics Card (optional)Up to NVIDIA® RTX 3090, 450W or more advanced in the future
GPS and Sensor

1 x Default U-blox NEO-M8N GNSS module for GPS/Glonass/QZSS/Galileo/Beidou

Optional modules with dead reckoning available

Built-in G-sensor


2-Port independent GbE LAN, M12 X-coded

9K byte jumbo frame

PTP (IEEE 1588) support

Controller: Intel® i210-T1, PHY: Intel® I219LM

vPro (iAMT) & WOL support

SecurityTPM 2.0: Infineon SLB9660TT1.2-FW4.40 (BOM optional)
I/O Ports, Front-Plate

Waterproof DC input connector with ignition for 24/36 VDC-IN

Power button

Reset button

6 x LED indicators for power/IGN/WLAN/WWAN/LAN status

4 x LED indicators for storage/fan control

5 x LED indicators for user to program

1 x USB 3.1 Gen2 + 1 x USB 2.0, type A

1 x DB15 (CAN/DIO, 4 x DI/4 x DO + 1 x CAN 2.0B)

1 x DB15 (EXT.), reserved for expansion (or DB9 for DR signal)

7 x SMA antenna holes

2 x DB9 (COM3/COM4) for RS232/RS422/RS485 selectable (isolation

I/O Ports, Rear-Plate

2 x USB 3.1 Gen2, type A

1 x M12 A-coded connector for 2 x USB 2.0

2 x GbE (M12 X-coded)

1 x VGA + 1 x HDMI

2 x DB9 (COM1/COM2) for RS232/RS422/RS485 selectable (isolation)

2 x SIM slots

1 x SMA antenna hole for GNSS

6 x SMA antenna holes

1 x PCIe x16 lane slot

3 x PCIe x4 lane slots

1 x DB9 (AUDIO, female) for 1 x Mic-in (stereo), 2 x Line-out (stereo)


1 x VGA port, up to 1920 x 1200@60Hz

1 x HDMI v1.4, up to 4096 x 2160@30Hz

DI/DO (isolation)

4-Bit input

- Source: 9~48V-IN (12V@1.1mA/24V@2.2mA)

- External: 0~33VDC pull-high, high-level, 3.3 - 33 VDC; low-level, 0-2 VDC

4-Bit output

- Source: 9~48V-IN (nominal 35mA@24V)

- External: 5~27VDC pull-high, sink current w/ 220mA for each bit, 500mA max (@25C)

Source or external can be selected by software (default: source type)


1 x CPU fan

1 x System fan

CAN 2.0B (isolation)

CAN 2.0B (isolation)

Controller: SJA1000

Bit rate up to 1Mbit/s

Socket CAN supported

11-bit & 29-bit identifiers, ISO 11898-1, ISO 11898-2

ESD: ± 8KV/15KV (contact/air)

2.5KV isolated

Power Management

24/36 VDC-IN

Cranking voltage: 6V~9V (< 30 seconds)

Reverse protection, OCP & UVP

Ignition on/off control/programmable on/off delay timer

Operating SystemWindows 10/Linux
Dimensions215 x 205 x 385 (W x D x H) (mm)
Weight10.5 kg
EnvironmentOperating temperatures

- EN 50155, class OT4 -40~70°C, 85°C for 10 minutes (w/ 35W TDP CPU, industrial SSD) with air flow

Storage temperatures: -40°C~85°C

Relative humidity: 10%~95% (non-condensing)

Vibration (random)

- IEC 60068-2-64 1.0g@5~500Hz (in operating, HDD), 1.6g for HDD w/ damping brackets

- IEC 60068-2-64 2.0g@5~500Hz (in operating, SSD + graphics card)

Vibration (SSD + graphics card)

- Operating: MIL-STD-810G, 514.6C, category 4

- Storage: MIL-STD-810G, 514.6, category 24, minimum integrity test

Shock (SSD + graphics card)

- Operating: MIL-STD-810G, Method 516.6, procedure I, functional shock=40g

- Non-operating: MIL-STD-810G, Method 516.6, procedure V, crash hazard shock test=75g



FCC Class A

EN 50155: 2017

- Ambient temperature EN 50155, Class OT4 (-40~70°C), 85°C for 10 minutes

- Interruptions of voltage supply class S1

- Supply change over class C1

- EMC EN 50121-1: 2017, EN 50121-3-2: 2016+A1: 2019

- Environment EN 60068-2-1, EN 60068-2-2, EN 60068-2-30

- Shock and vibration IEC 61373 Class B

- Protective coating class PC1 (PC2, by request)

EN 45545-2: 2013+A1:2015 (PCB)

aROK 8110-A (P/N: 10A20811000X0)

Barebone system. Intel® 8th/9th Gen Core™/Xeon® CPU (LGA 1151), dual SO-DIMM up to 64GB DDR4

VTK-GEM640 (P/N: 10VK00GEM00X0)

4 x M12 X-coded independent GbE/GigE PCIe 3.0 card, PoE+, total 60W


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