ICES 675

第8代英特尔®酷睿™/至强®处理器的COM Express类型6针脚输出

第八代英特尔®酷睿™处理器,BGA 1440,PCH CM246

2通道DDR4,采用ECC或非ECC SO-DIMM 2666MHz,最高可达32GB

支持三显示器VGA,2 x DP,eDP/LVDS 24位双通道

PCI express lane x16(可配置:"1 x 16";"2 x 8";"1 x 8 + 2 x 4")

PCI express lane x1 (Gen 3), 8 x (可配置为x 1, x 4)

IO:2 x UART(RX/TX),8位DIO,WDT,TPM(可选)


ICES 675是一个COM express类型的6-pinouts基本模块,采用英特尔® C240系列PCH芯片组,支持英特尔®第八代和英特尔®至强®和英特尔®酷睿™处理器的2通道DDR4,ECC或非ECC SO-DIMM 2666MHz,最高可达32GB。ICES 675集成英特尔®高清图形引擎支持或通过PCI Express图形1 x16通道扩展,支持三个DDI(数字显示接口),遵循PICMG COM2.0规范的标准。它允许6针脚载板实现DDI和传统的VGA接口。


通过125 x 95mm的6型COM快递模块,该板提供了许多处理器变体。Intel® Xeon® E-2176M处理器(支持ECC)、Intel® Core™ i7-8850H处理器(非ECC)和Intel® Core™ i5-8400H处理器(非ECC)。


高性能的ICES 675 COM express基本模块支持1 x GbE LAN、4 x USB 3.1 GEN1、8 x USB 2.0、4 x SATA 3.0、2 x UART(TX/RX)、HD音频、8位DIO、TPM(可选)ICEB 8060以及为您的嵌入式项目定制解决方案。


CPU

8th Gen Intel® Core™ processors, BGA 1440

Intel® Xeon® E-2176M processor, 6 Cores, 12M Cache, 2.7GHz (4.4GHz), 45W (support ECC)

Intel® Core™ i7-8850H processor, 6 Cores, 12M Cache, 2.6GHz (4.3GHz), 45W

Intel® Core™ i5-8400H processor, 4 cores, 8M Cache, 2.5GHz (4.2GHz), 45W

Intel® Mobile CM246

内存Dual channel DDR4 SO-DIMM memory socket with non-ECC support, up to 32 GB 2666MHZ, ECC support as option with Intel® Xeon® E-2176M processor
显示

Integrated Intel® Gen9 graphics graphic engine

1 x VGA connector (resolution up to 1920x1080 @60Hz)

1 x LVDS connector(resolution up to 1920x1080 @60Hz)

DDI 1/2 port configurable to HDMI 1.4/DVI/Display port 1.4 HDMI up to 4096x2160 @30Hz/24bpp, DVI up to 1920x1200 @60Hz, DP up to 4096x2304 @60Hz

BIOSAMI (UEFI)
COM Express连接器

AB: LVDS: (LVDS/eDP co-lay), VGA: (VGA/DDI port3 co-lay), 1 x GbE LAN, 6 x PCIex1, HD Audio, 4 x SATA III, 8 x USB 2.0, LPC Bus,

SM Bus/I2C, 2 x COM, GPIO 8-bit

CD: DDI1, DDI2, 1 x PCIe x16, 2 x PCIe x1, 4 x USB 3.0

电源

+12VDC, +5Vsb

Support both AT and ATX power supply mode

尺寸125 mm x 95 mm
环境

Board level operation temperture: -0°C to 60°C

Storage temperture: -20˚C to 85˚C

Relative humidty:

10% to 95% (operating, non-condensing)

5% to 95% (non-operating, non-condensing)

认证

Meet CE

FCC Class B


ICES 675 (P/N: 10K00067500X0)

On-board Intel® 8th Intel® Xeon® E-2176M processorr, 2 x DDR4 SO-DIMM (support ECC), support multiple display from VGA/LVDSD/DDI1/2, 4 x SATAIII, 1 x GbE LAN, 2 x COM, 4 x USB 3.0, 8 x USB 2.0, HD audio, 8-bit GPIO


ICES 675-8850H (P/N: 10K00067502X0)

On-board Intel® 8th Intel® Core™ i7-8850H processor, 2 x DDR4 SO-DIMM (non-ECC), support multiple display from VGA/LVDSD/DDI1/2, 4 x SATAIII, 1 x GbE LAN, 2 x COM, 4 x USB 3.0, 8 x USB 2.0, HD audio, 8-bit GPIO


ICES 675-8400H (P/N: 10K00067501X0)

On-board Intel® 8th Intel® Core™ i5-8400H processor, 2 x DDR4 SO-DIMM (non-ECC), support multiple display from VGA/LVDSD/DDI1/2, 4 x SATAIII, 1 x GbE LAN, 2 x COM, 4 x USB 3.0, 8 x USB 2.0, HD audio, 8-bit GPIO


Optional Accessories

CPU cooler (P/N:TBD)

Heat spreader (P/N:TBD)

TPM 2.0 module KIT (P/N:79E00TPM01X00)


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