ICES 674
板载6/7代Intel® Core™ i7/i5/i3/Xeon® + PCH QM175/CM238(可选)
2通道DDR4与非ECC/SO-DIMM 2133MHZ,最高可达32GB
支持显示LVDS/VGA/DDI 1/DDI 2
PCIe x16/8 PCIe x1, 4 x USB 3.0, 8 x USB 2.0, 4 x SATA 3.0和GBE
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ICES 674是一个COM express类型的6-pinouts基本模块,采用英特尔®100系列PCH芯片组,支持英特尔®第六代和第七代英特尔®酷睿™,具有双DDR4 SO-DIMM插槽,最高可达32GB DDR4 2400MHz SDRAM。
ICES 674集成英特尔®高清图形引擎支持或通过PCI Express图形1 x 16通道进行扩展,并支持三个DDI(数字显示接口),遵循PICMG COM2.0规范的标准。它允许6针脚载板实现DDI和传统的VGA接口。通过125 x 95毫米的6型COM快递模块,该板提供了许多处理器变体。英特尔®酷睿™i7/i5的四核或双核。
高性能的ICES 674 COM express基本模块可以支持4 x USB 3.0/8 x USB 2.0,4 x SATA 3.0和8 x PCIe x 1通道,以及通过我们设计的ICEB 8060嵌入式项目定制解决方案。
CPU/芯片 | Support Intel® Mobile QM175 Intel® i7-7820EQ Core™ i7, 4 x 3.0 GHz (3.7 GHz), GT2, 45/35 W Intel® i7-6820EQ Core™ i7, 4 x 2.8 GHz (3.5 GHz), 45 W Intel® i7-6822EQ Core™ i7, 4 x 2.0 GHz (2.8 GHz), 25 W Intel® i5-7440EQ Core™ i5, 4 x 2.9 GHz (3.6 GHz), GT2, 45/35 W Intel® i5-7442EQ Core™ i5, 4 x 2.1 GHz (2.9 GHz), GT2, 25 W Intel® i5-6440EQ Core™ i5, 4 x 2.7 GHz (3.4 GHz), 45 W Intel® i5-6442EQ Core™ i5, 4 x 1.9 GHz (2.7 GHz), 25 W |
内存 | Dual channel DDR4 SO-DIMM memory socket with non-ECC support, up to 32 GB 2133/2400MHZ |
显示 | Integrated Intel® Gen 9 graphics graphic engine 1 x VGA connector (resolution up to 1920 x 1080 @ 60Hz) 1 x LVDS connector (resolution up to 1920 x1080 @ 60Hz) DDI 1/2 port configurable to HDMI 1.4/DVI/DisplayPort 1.2 HDMI up to 4096 x 2160 @ 30/24Hz, DVI up to 1920 x1200 @ 60Hz, DP up to 4096 x 2304 @ 60Hz) |
BIOS | Up to 1 x 8MB (128Mb) SPI flash ROMs AMI (UEFI) |
COM Express连接器 | AB : LVDS, VGA (VGA/eDP co-lay), 1 x Gbe LAN, 6 x PCIe x1, HD Audio, 4 x SATA III, 8 x USB 2.0, LPC Bus, SM Bus/I2C, 2 x COM, GPIO 8-bit CD : eDP (VGA/eDP co-lay), DDI1, DDI2, 1 x PCIe x16, 2 x PCIe x1, 4 x USB 3.0 |
电源 | +12VDC, +5Vsb Support both AT and ATX power supply mode |
尺寸 | 125mm (W) x 95mm (L) |
环境 | Board level operation temperture : -15°C to 60°C Storage temperture : -20˚C to 85˚C Relative humidty: - 10% to 95% (operating, non-condensing) - 5% to 95% (non-operating, non-condensing) |
认证 | Meet CE FCC Class A |
ICES 674 (P/N: 10K00067400X0)
On-board Intel® 7th i7-7820E processor, w/DDR4 SO-DIMM, support multiple display from VGA/LVDSD/DDI1/2, 4 x SATA III, 1x GbE LAN, 2 x COM, 4 x USB 3.0, 8 x USB 2.0, HD audio, 8bit GPIO
ICES 674-644EQ (P/N: 10K00067401X0)
On-board Intel® 6th ICES 674-644 EQ processor, w/DDR4 SO-DIMM, support multiple display from VGA/LVDSD/DDI1/2, 4 x SATA III, 1 x GbE LAN, 2 x COM, 4 x USB 3.0, 8 x USB 2.0, HD audio, 8-bit GPIO
Optional Accessories
ICES 674 heat spreader thermal pad screw (P/N: 79K0067401X00)
ICES 674 cpu cooler fan heat sink screw (P/N: 79K0067402X00)
说明
散热器。散热器作为模块的热耦合装置,通过热隙填料与CPU进行热耦合。在一些模块上,它还可以通过使用额外的热隙填料与其他发热元件进行热耦合。尽管散热器是模块产生的大部分热量的散热界面,但它不能被视为散热器。它被设计为模块和特定应用的热解决方案之间的热界面。