nROK 7252-WI2-C8S

Fanless Rolling Stock Computer with Intel® 8th/9th Gen Core™/Xeon® CPU

Intel® Coffee Lake S/Refresh 8th/9th Gen Core™/Xeon® LGA1151 socket-type CPU

Six SIM cards + three WWAN modules support

LTE/5G WWAN module support

2 x External SSD for RAID 0, 1, 5, 10 (compatible with 15mm disk)

2 x mSATA (occupied mini-PCIe slot)

EN 50155, class OT4 conformity

Three video outputs, one VGA and two HDMI

3 x mini-PCIe + 2 x M.2 socket expansion

1 x SD card for exporting and backing up data

Wide voltage input 24~110VDC (w/ isolation)

Up to 3-sec protection against temporary voltage dips


nROK 7252 accomplishes operational efficiency of public transportation and service. Based on Intel® Coffee Lake S/Refresh 8th/9th Gen Core™/Xeon® LGA1151 socket-type CPU and 8-port 802.3 af/at PoE, it provides an integral solution incorporating high computing power. with dual SIM cards per modem support, it allows six SIM cards backup each other for a better connectivity quality by software. In addition, six SIM cards and three WWAN modules architecture can increase the bandwidth for a faster data transmission speed. RAID 0, 1, 5, 10 guarantees the safety of data in the 2 x external SSD. nROK 7252 keeps the flexibility to meet the demand for different rolling stock applications, such as infotainment, transportation cellular router, video server, and video surveillance.

CPU

Support 9th/8th generation Intel® Core™ i7/i5/i3, Xeon® LGA1151 socket

- Intel® Core™ i7-9700TE/i7-8700T, TDP 35W

- Intel® Core™ i5-9500TE/i5-8500T, TDP 35W

- Intel® Core™ i3-9100TE/i3-8100T, TDP 35W

- Intel® Xeon® E-2278GEL, TDP 35W

- Intel® Celeron® G4900T, TDP 35W

ChipsetIntel® C246 platform controller hub
Memory

2 x 260-pin DDR4 SO-DMIM sockets up to 32GB/channel (64GB for two channels)

ECC memory to support: i3-9100TE/i3-8100T, E-2278GEL, G4900T

Video OutputChipset Intel® UHD graphics 630

2 x HDMI 1.4b up to 4096 x 2160 @ 30Hz

1 x VGA up to 1920 x 1200 @ 60Hz

Storage

2 x 2.5” SATA 3.0 external SSD (15mm)

2 x mSATA (occupied mini-PCIe slot)

1 x Removable SD 3.0

Expansion

1 x Full size mini-PCIe socket (USB 2.0, PCIe 3.0/SATA)

1 x Full size mini-PCIe socket (USB 2.0, PCIe 3.0/SATA), BOM optional M.2 3042 Key B socket (USB 2.0, USB 3.1 Gen 1) for LTE/5G NR module with 2 x external SIM

1 x Full size mini-PCIe socket (USB 2.0, USB 3.1 Gen 2 (BOM optional)) for LTE module, BOM optional M.2 3042/3050/3052 Key B socket (USB 2.0, USB 3.1 Gen 2, PCIe 3.0 (BOM optional)) for LTE/5G NR module with 2 x external SIM

2 x M.2 3042/3050/3052 Key B socket (USB 2.0, USB 3.1 Gen 2, PCIe 3.0 (BOM optional)) for LTE/5G NR module with 2 x external SIM

GNSS and Onboard Sensor1 x Default U-blox NEO-M8N GNSS module for GPS/Glonass/QZSS/Galileo/Beidou

Optional M8U modules with dead reckoning available

G Sensor (3-axis, 10-bit resolution)

LAN and Power over Ethernet2-Port LAN M12 X-coded, 10/100/1000 Mbps Intel® I210/I219 (support iAMT) GbE

8-Port LAN M12 X-coded, 10/100/1000 Mbps Ethernet Switch GbE, PoE 802.3af/at, max. 60W

SecurityTPM 2.0: Infineon SLB9665TT2.0FW5.62 (BOM optional)
I/O Interface-Front

24 x LED indicators (including 3 x programmable LED)

2 x HDMI 1.4b

1 x VGA

1 x USB 3.1 Gen 2 type A (5V/1A)

1 x USB 3.1 Gen 1 type A (5V/1A)

6 x Externally accessible SIM card sockets with cover

2 x 2.5” removable SSD tray

1 x SD with cover

1 x Reset button

1 x Power button

10 x SMA antenna

I/O Interface-Rear2 x LAN M12 X-coded, I210/I219 10/100/1000 Mbps

8 x PoE 802.3af/at (max. 60W), M12 X-coded

1 x Mic-in, 2 x Line-out (AUDIO, DB9, female)

1 x M12 A-coded connector for 2 x USB 2.0

2 x USB 3.1 (5V/1A) type A

2 x DB9 (COM1/COM2) for full RS232 (isolation)

1 x DB9 (COM3) for full RS232/422/485 (isolation)

1 x DB15 (CAN/DIO)

- 1 x Isolated CANBus 2.0B

- 4 x DI and 4 x DO (isolation)

- Power in for DIO isolation, 9~48VDC

1 x Waterproof DC input connector with ignition

- 24~110VDC (w/ isolation)

3 x SMA antenna

Power Management & Software SupportPower input 24~110VDC w/ isolation

1.65~3-sec (250W~120W) protection against temporary voltage dips

Selectable boot-up & shut-down voltage for low power protection by software

Setting 8-level power on/off delay time by software

Support S3/S4 suspend mode

10~255 seconds WDT support, setup by software

SDK (Windows/Linux) including utility and sample code

Operating SystemWindows 10/Linux
Dimensions260 x 266 x 110 (W x D x H) (mm)
Weight7.6kg
EnvironmentOperating temperatures: EN 50155, class OT4 -40~70°C, 85°C for 10 minutes (w/ industrial SSD) with air flow

Storage temperatures: -40°C to 80°C

Relative humidity: 90% (non-condensing)

Vibration (random)

- 2g@5~500 Hz (in operation, SSD)

Vibration (SSD)

- Operating: MIL-STD-810G, Method 514.6, Category 4, common carrier US highway truck vibration exposure

- Storage: MIL-STD-810G, Method 514.6, Category 24, minimum integrity test

Shock (SSD)

- Operating: MIL-STD-810G, Method 516.6, Procedure I, functional shock=40g

- Non-operating: MIL-STD-810G, Method 516.6, Procedure V, crash hazard shock test=75g

Certifications

CE

FCC Class A

EN 50155: 2017

- Ambient temperature EN 50155, Class OT4 (-40~70°C), 85°C for 10 minutes

- Interruptions of voltage supply class S1, S2

- Supply change over class C1, C2

- EMC EN 50121-1: 2017, EN 50121-3-2: 2016+A1: 2019

- Environment EN 60068-2-1, EN 60068-2-2, EN 60068-2-30

- Shock and vibration IEC 61373 Class B

- Protective coating class PC1 (PC2, by request)

EN 45545-2: 2013+A1:2015


nROK 7252-WI2-C8S (P/N: 10A00725203X0)

System bare-bone. Intel® Coffee-Lake S/Refresh/Xeon®, DC input 24V~110V (w/ isolation), 8 x PoE, 2 x SSD tray


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